View MF1S5009_3105903.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. general description nxp semiconductors has developed the mifare MF1S5009 to be used in a contactless smart card according to iso/iec 14443 type a. the MF1S5009 features a double size uid for early adopters among existing mi fare classic systems which are planning to migrate from the currently used single size uid to double size uid. the mifare MF1S5009 ic is used in applic ations like public transport ticketing where major cities have adopted mifare as their e-ticketing solution of choice. 1.1 key applications ? public transportation ? access control ? event ticketing ? gaming and identity 1.2 anticollision an intelligent anticollision functi on allows to operate more than one card in the field simultaneously. the anticollision al gorithm selects each card in dividually and ensures that the execution of a transaction with a selected card is performed correctly without data corruption resulting from other cards in the field. 1.3 simple integration and user convenience the MF1S5009 is designed for simple integration and user convenience which could allow complete ticketing tran sactions to be handled in less than 100 ms. thus, the MF1S5009 card user is not forced to stop at the reader leading to a high throughput at gates and reduced boarding times onto busses. MF1S5009 mainstream contactless smart card ic for fast and easy solution development rev. 3 ? 27 july 2010 189131 product data sheet public fig 1. mifare card reader 001aam19 9 mifare card pcd energy data
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 2 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 1.4 security ? unique identifier for each device using double size uid (7 byte uid) ? mutual three pass authentication (iso/iec 9798-2) ? individual set of two keys per sector (per application) to support multi-application with key hierarchy 1.5 delivery options ? bumped die on wafer ? moa4 contactless module 2. features and benefits 2.1 mifare? rf interface (iso/iec 14443 a) ? contactless transmission of data and supply energy (no battery needed) ? operating distance up to 100 mm depending on antenna geometry and reader configuration ? operating frequency of 13.56 mhz ? data transfer of 106 kbit/s ? data integrity of 16-bit crc, parity, bit coding, bit counting ? anticollision ? typical ticketing transaction time of < 100 ms (including backup management) 2.2 eeprom ? 1 kb, organized in 16 sectors with 4 blocks of 16 bytes each (one block consists of 16 byte) ? user definable access condit ions for each memory block ? data retention time of 10 years ? write endurance 100000 cycles
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 3 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 3. applications ? public transportation ? access management ? electronic toll collection ? car parking ? school and campus cards ? employee cards ? internet cafs ? loyalty 4. ordering information 5. block diagram table 1. ordering information type number package commerci al name name description version MF1S5009dud ffc - 8 inch wafer, 120 m thickness, on film frame carrier, electronic fail die marking according to secs-ii format) - MF1S5009da4 moa4 pllmc plastic leadless module carrier package; 35 mm wide tape sot500-2 fig 2. block diagram 001aal73 2 rf interface uart iso/iec 14443a logic unit crc eeprom crypto1 power on reset voltage regulator clock input filter reset generator
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 4 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 6. pinning information 6.1 smart card contactless module 7. mechanical specification fig 3. contact assignments for sot500-2 (moa4) table 2. bonding pad assignments to smart card contactless module contactless interface module MF1S5009da4 antenna contacts symbol description la la antenna coil connection la lb lb antenna coil connection lb 001aam20 0 top view la lb table 3. specifications wafer diameter 200 mm typical (8 inches) maximum diameter afte r foil expansion 210 mm thickness 120 m 15 m flatness not applicable potential good dies per wafer (pgdw) 18482 wafer backside material si treatment ground and stress relieve roughness r a max = 0.2 m r t max = 2 m chip dimensions step size x = 1231 m y = 1280 m
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 5 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic [1] the gap between chips may vary due to changing foil expansion. [2] pads p1, tp2 and vss are disconnected when wafer is sawn. 7.1 fail die identification electronic wafer mapping covers the electrical test results and additionally the results of mechanical/visual inspection. no ink dots are applied. gap between chips [1] typical = 15 m minimum = 5 m passivation type sandwich structure material nitride thickness 1.75 m au bump (substrate connected to vss) material > 99.9 % pure au hardness 35 to 80 hv 0.005 shear strength >70 mpa height 18 m height uniformity within a die = 2 m within a wafer = 3 m wafer to wafer = 4 m flatness minimum = 1.5 m size la, lb = 69 m 69 m p1;tp2;vss [2] =58 m 58 m size variation 5 m under bump metallization sputtered tiw table 3. specifications
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 6 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 8. chip orientation and bond pad locations (1) the air gap may vary due to varying foil expansion (2) measured from outer sealring edge (see detail) all dimensions in m fig 4. chip orientation and bond pad locations 001aam20 1 bump size la, lb vss, tp1, tp2 chip step 69 58 1231 (1) 69 x ( m) y ( m) 58 1280 (1) la tp1 tp2 vss lb typ. 15.0 (1) min. 5.0 typ. 36.4 (1)(2) min. 26.4 typ. 15.0 (1) min. 5.0 1071.0 (2) typ. 36.4 (1)(2) min. 26.4 y x 1070.0 (2) 52.3 (2) 51.3 (2) 239.2 (2) 368.7 (2) 556.6 (2) 807.7 (2) 1231.0 (1) 1280.0 (1) 52.9 (2) dimensions in m
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 7 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9. functional description 9.1 block description the MF1S5009 chip consists of a 1 kb eeprom, rf interfac e and digital control unit. energy and data are transferred via an antenna consisting of a coil with a small number of turns which is directly connected to the mf 1s5009. no further external components are necessary. refer to the document ref. 1 for details on antenna design. ? rf interface: ? modulator/demodulator ? rectifier ? clock regenerator ? power-on reset (por) ? voltage regulator ? anticollision: multiple cards in the field may be se lected and mana ged in sequence ? authentication: preceding any memory operation the authentication procedure ensures that access to a bl ock is only possible via the two keys specified for each block ? control and arithmetic logic unit: values are stored in a special redundant format and can be incremented and decremented ? eeprom interface ? crypto unit: the crypto1 stream cipher of the MF1S5009 is used for authentication and encryption of data exchange. ? eeprom: 1 kb is organized in 16 sectors with 4 blocks each. a block contains 16 bytes. the last block of each sector is called ?trailer?, which contains two secret keys and programmable access conditions for each block in this sector. 9.2 communication principle the commands are initiated by the reader and co ntrolled by the digital control unit of the MF1S5009 according to the access conditions valid for the corresponding sector. 9.2.1 request standard / all after power on reset (por) the card answers to a request reqa or wakeup wupa command with the answer to request code (see section 10.4 , atqa according to iso/iec 14443a). 9.2.2 anticollision loop in the anticollision loop the identifier of a ca rd is read. if there ar e several cards in the operating field of the reader, they can be dist inguished by their identifier and one can be selected (select card) for further transactions. the unselected cards return to the idle state and wait for a new request command. the anticollision is done with two cascade levels as defin ed in iso/iec 14443-3, see also ref. 6 .
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 8 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.2.3 select card with the select card command the reader sele cts one individual card for authentication and memory related operations. the card returns the sele ct acknowledge (sak) code which determines the type of the selected card, see section 10.4 . for further details refer to the document ref. 2 , the handling of double size uids in mifare classic is described in ref. 6 . 9.2.4 three pass authentication after selection of a card the reader specifies the memory location of the following memory access and uses the corresponding key for the three pass authenticat ion procedure. after a successful authentication all memory operations are encrypted. fig 5. three pass authentication 001aam20 2 request standard transaction sequence typical transaction time select card por transfer anticollision loop get identifier 3 pass authentication on specific sector read block write block decre- ment incre- ment re- store halt request all identification and selection procedure without collision ~3 ms authentication procedure ~3 ms for each collision +~3 ms memory operations read block ~2.5 ms write block ~6.0 ms de-/increment ~2.5 ms transfer ~4.5 ms
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 9 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.2.5 memory operations after authentication any of the following operations may be performed: ? read block ? write block ? decrement: decrements the contents of a block and stores the result in a temporary internal data-register ? increment: increments the contents of a block and stores the result in the data-register ? restore: moves the contents of a block into the data-register ? transfer: writes the contents of the temporary internal data-register to a value block 9.3 data integrity following mechanisms are implemented in the contactless communication link between reader and card to ensure very reliable data transmission: ? 16 bits crc per block ? parity bits for each byte ? bit count checking ? bit coding to distinguish between ?1?, ?0? and ?no information? ? channel monitoring (protocol sequence and bit stream analysis) 9.4 three pass authentication sequence 1. the reader specifies the sector to be accessed and chooses key a or b. 2. the card reads the secret key and the access conditions from the sector trailer. then the card sends a random number as the challenge to the reader (pass one). 3. the reader calculates the response using the secret key and additional input. the response, together with a random challenge from the reader, is then transmitted to the card (pass two). 4. the card verifies the response of the reader by comparing it with its own challenge and then it calculates the response to th e challenge and transmits it (pass three). 5. the reader verifies the response of the card by comparing it to its own challenge. after transmission of the first random challenge the communication between card and reader is encrypted.
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 10 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.5 rf interface the rf-interface is according to the standard for contactless smart cards iso/iec 14443 a. the carrier field from the reader is always pr esent (with short pauses when transmitting), because it is used for the power supply of the card. for both directions of data communication ther e is only one start bit at the beginning of each frame. each byte is transmitted with a pa rity bit (odd parity) at the end. the lsb of the byte with the lowest address of the selected block is transmitted first. the maximum frame length is 163 bits (16 data bytes + 2 crc bytes = 16 * 9 + 2 * 9 + 1 start bit). 9.6 memory organization the 1024 x 8 bit eeprom memory is organized in 16 sectors with 4 blocks of 16 bytes each. in the erased state the eeprom cells are read as a logical ?0?, in the written state as a logical ?1?. fig 6. memory organization 001aam203 byte number within a block 15 14 13 12 11 10 9 8 7 6 5 key a access bits key b 4 3 2 1 0 block 3 sector 15 2 1 0 description sector trailer 15 data data data sector trailer 14 data data data sector trailer 0 data data manufacturer block sector trailer 1 data data data 3 14 2 1 0 3 1 2 1 0 3 0 2 1 0 : : : : : : key a access bits key b key a access bits key b key a access bits key b
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 11 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.6.1 manufacturer block this is the first data block (block 0) of the first sector (sector 0). it contains the ic manufacturer data. this block is programmed and write protected in the production test. 9.6.2 data blocks all sectors contain 3 blocks of 16 bytes for storing data (sector 0 contains only two data blocks and the read-only manufacturer block). the data blocks can be config ured by the access bits as ? read/write blocks for e.g. contactless access control or ? value blocks for e.g. electr onic purse applications, wh ere additional commands like increment and decrement for direct cont rol of the stored value are provided. an authentication command has to be carried out before any memory operation in order to allow further commands. 9.6.2.1 value blocks the value blocks allow to perform electronic purse functions (valid commands: read, write, increment, decrement, restore, transfer).the va lue blocks have a fixed data format which permits error detection and correction and a backup management. a value block can only be generated through a write operation in the value block format: ? value: signifies a signed 4-byte value. the lo west significant byte of a value is stored in the lowest address byte. negative values are stored in standard 2s complement format. for reasons of data integrity and se curity, a value is stored three times, twice non-inverted and once inverted. ? adr: signifies a 1-byte address, which can be used to save the storage address of a block, when implementing a powerful backup management. the address byte is stored four times, twice inverted and n on-inverted. during increment, decrement, restore and transfer operations the address remains unchanged. it can only be altered via a write command. fig 7. manufacturer block 001aam20 4 15 14 13 12 11 10 9 8 7 6 5 4 3 uid manufacturer data block 0/sector 0 2 1 byte 0 fig 8. value blocks 001aam20 5 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 byte number 0 adr adr adr adr value value value description
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 12 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.6.3 sector trailer (block 3) each sector has a sector trailer containing the ? secret keys a and b (optional), which return logical ?0?s when read and ? the access conditions for the four blocks of th at sector, which are st ored in bytes 6...9. the access bits also specify the type (r ead/write or value) of the data blocks. if key b is not needed, the last 6 bytes of block 3 can be used as data bytes. byte 9 of the sector trailer is available for user data. for this byte the same access rights as for byte 6, 7 and 8 apply. all keys are set to ffffffffffff h at chip delivery. 9.7 memory access before any memory operation can be carried out, the card has to be selected and authenticated as described previously. the po ssible memory operations for an addressed block depend on the key used and the access conditions stored in the associated sector trailer. fig 9. sector trailer 001aam20 6 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 byte number 0 key a key b (optional) access bits description table 4. memory operations operation description valid for block type read reads one memory block read/wr ite, value and sector trailer write writes one memory block read/wr ite, value and sector trailer increment increments the contents of a block and stores the result in the internal data register value decrement decrements the contents of a block and stores the result in the internal data register value transfer writes the contents of the internal data register to a block value restore reads the contents of a block into the internal data register value
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 13 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.7.1 access conditions the access conditions for every data block and sector trailer are defined by 3 bits, which are stored non-inverted and inverted in th e sector trailer of the specified sector. the access bits control the rights of memory access using the secret keys a and b. the access conditions may be altered, provided one knows the relevant key and the current access condition allows this operation. remark: with each memory access the internal lo gic verifies the format of the access conditions. if it detects a format violatio n the whole sector is irreversible blocked. remark: in the following description the access bits are mentioned in the non-inverted mode only. the internal logic of the MF1S5009 ensures that the commands are executed only after an authentication procedure or never. table 5. access conditions access bits valid commands block description c1 3 c2 3 c3 3 read, write 3 sector trailer c1 2 c2 2 c3 2 read, write, increment, decrement, transfer, restore 2 data block c1 1 c2 1 c3 1 read, write, increment, decrement, transfer, restore 1 data block c1 0 c2 0 c3 0 read, write, increment, decrement, transfer, restore 0 data block fig 10. access conditions 001aam20 7 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 byte number 0 key a key b (optional) access bits byte 6 c2 3 c2 2 c2 1 c2 0 c1 3 c1 2 c1 1 c1 0 7 bit 6543210 byte 7 c1 3 c1 2 c1 1 c1 0 c3 3 c3 2 c3 1 c3 0 byte 8 c3 3 c3 2 c3 1 c3 0 c2 3 c2 2 c2 1 c2 0 byte 9
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 14 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 9.7.2 access conditions for the sector trailer depending on the access bits for the sector tr ailer (block 3) the read/write access to the keys and the access bits is specified as ?never?, ?key a?, ?key b? or key a|b? (key a or key b). on chip delivery the access cond itions for the sector trailers and key a are predefined as transport configuration. since key b may be read in transport configuration, new cards must be authenticated with key a. since the ac cess bits themselves can also be blocked, special care should be taken during personalization of cards. [1] for this access condition key b is readable and may be used for data 9.7.3 access conditions for data blocks depending on the access bits for data blocks (blocks 0...2) the read/write access is specified as ?never?, ?key a?, ?key b? or ?k ey a|b? (key a or key b). the setting of the relevant access bits defines the applicatio n and the corresponding applicable commands. ? read/write block: the operati ons read and write are allowed. ? value block: allows the additional value operations increment, decrement, transfer and restore. in one case (?001?) only read and decrement are possible for a non-rechargeable card. in the other case (?110?) recharging is possible by using key b. ? manufacturer block: the read-only condition is not affected by the access bits setting! ? key management: in transport configuration key a must be used for authentication table 6. access conditions for the sector trailer access bits access condition for remark keya access bits keyb c1 c2 c3 read write read write read write 0 0 0 never key a key a never key a key a key b may be read [1] 0 1 0 never never key a never key a never key b may be read [1] 1 0 0 never key b key a|b never never key b 1 1 0 never never key a|b never never never 0 0 1 never key a key a key a key a key a key b may be read, transport configuration [1] 0 1 1 never key b key a|b key b never key b 1 0 1 never never key a|b key b never never 1 1 1 never never key a|b never never never
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 15 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic [1] if key b may be read in the corresponding sector traile r it cannot serve for authentication (all grey marked lines in previous table). consequences : if the reader tries to authenticate any block of a sector with key b using grey marked access conditions, the card wi ll refuse any subsequent memory access after authentication. table 7. access conditions for data blocks access bits access condition for application c1 c2 c3 read write increment decrement, transfer, restore 0 0 0 key a|b [1] key a|b1 key a|b1 key a|b1 transport configuration 0 1 0 key a|b [1] never never never read/write block 100key a|b [1] key b 1 never never read/write block 110key a|b [1] key b 1 key b 1 key a|b 1 value block 0 0 1 key a|b [1] never never key a|b 1 value block 011key b [1] key b 1 never never read/write block 101key b [1] never never never read/write block 1 1 1 never never never never read/write block
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 16 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 10. command overview the mifare card activation follows the iso/ie c 14443-3 type a. af ter the mifare card has been selected, it can either be deactiv ated using the iso/iec 14443 halt command, or the mifare commands can be performed. fo r more details about the card activation refer to ref. 4 . 10.1 mifare command overview all mifare classic commands use the mifare crypto1 and require an authentication. all available commands for the mifare classic are shown in ta b l e 8 . all the commands use the coding and framing as described in ref. 3 and ref. 4 (e.g. parity) if not otherwise specified. 10.2 timings in this document the timing shown is not to scale and rounded to 1 s. all the given times refer to the data frames including start of communication and end of communication, but do not include the encoding (like the miller pulses). consequently a data frame sent by the pcd c ontains the start of communication (1 ?start bit?) and the end of communication (one logic 0 + 1 bit length of unmodulated carrier). a data frame sent by the picc contains the st art of communication (1 ?start bit?) and the end of communication (1 bit length of no subcarrier). table 8. command overview command iso/iec 14443 command code (hexadecimal) request reqa 26h (7 bit) wake-up wupa 52h (7 bit) anticollision cl1 anticollision cl1 93h 20h anticollision cl2 anticollision cl2 95h 20h select cl1 select cl1 93h 20h select cl2 select cl2 95h 20h halt halt 50h 50h authentication with key a - 60h authentication with key b - 61h mifare read - 30h mifare write - a0h mifare decrement - c0h mifare increment - c1h mifare restore - c2h mifare transfer - b0h halt - 50h 00h
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 17 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic all timing can be measured according to iso/iec 14443-3 frame specification as shown for the frame delay time in figure 11 . for more details refer to ref. 3 and ref. 4 . fdtpcd2picc = frame delay time pcd to picc. fdtpicc2pcd = frame delay time picc to pcd (must be at least 87 s). remark: due to the coding of commands, the me asured timings usually exclude (a part of) the end of communication. this needs to be considered, when comparing the given times with the measured ones. 10.3 mifare ack and nak the mifare classic uses a 4 bit ack / nak as shown in table 9 . (1) measurement of the fdt (frame delay time) from pcd to picc fig 11. frame delay time (from pcd to picc), and t ack and t nak 001aam20 8 last data bit transmitted by pcd fdt = (n* 128 + 84)/fc 256/fc end of communication (e) 128/fc logic ''1'' 128/fc start of communication (s) first modulation of picc fdt = (n* 128 + 20)/fc 256/fc end of communication (e) t ack , t nak 128/fc logic ''0'' 128/fc start of communication (s) table 9. mifare ack and nak code (4-bit) ack/nak ah acknowledge (ack) 0h to 9h nak bh to fh nak
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 18 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 10.4 atqa and sak responses for details on the type identificati on procedure please refer to ref. 2 . the MF1S5009 answers to a reqa or wupa command with the atqa value shown in ta b l e 1 0 and to a select cl1 command with the sak value shown in ta b l e 11 . table 10. atqa response of the MF1S5009 bit number response hex value 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 atqa 00 44 h 0000000001000100 table 11. sak response of the MF1S5009 bit number response hex value 8 7 6 5 4 3 2 1 sak 08 h 00001000
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 19 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 11. mifare classic commands 11.1 mifare authentication the mifare authentication is a 3-pass mutual authentication which needs two pairs of command-response. these two pa rts, mifare authentication pa rt 1 and part 2 are shown in figure 12 , figure 13 and table 12 . ta b l e 1 3 shows the required timing. fig 12. mifare authentication part 1 fig 13. mifare authentication part 2 001aam20 9 crc addr pcd auth token rb picc ,,ack'' 368 s 359 s picc nak ,,nak'' time out t timeout t nak t ack 59 s 001aam21 0 token ab pcd token ba picc ,,ack'' 708 s 359 s picc nak ,,nak'' time out t timeout t nak t ack 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 20 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic remark: the minimum required time between mifare authentication part 1 and part 2 is the minimum required fdt according to ref. 4 . there is no maximum specified. remark: the mifare authentication and encryption requires an mifare reader ic (e.g. the cl rc632). for more details about th e authentication co mmand refer to the corresponding data sheet (e.g. ref. 5 ). 11.2 mifare read the mifare read requires a block address, and returns the 16 bytes of one mifare classic block. the command structure is shown in figure 14 and ta b l e 1 4 . ta b l e 1 5 shows the required timing. table 12. mifare authentication command name code description length auth (with key a) 60h authentication with key a 1 byte auth (with key b) 61h authentication with key b 1 byte addr - mifare block address (00h to ffh) 1 byte crc - crc according to ref. 4 2 bytes token rb - challenge 1 (random number) 4 bytes token ab - challenge 2 (random number) 8 bytes token ba - challenge 2 (random number) 4 bytes nak see table 9 see section 10.3 4-bit table 13. mifare authentication timing these times exclude the end of communication of the pcd. t ack min t ack max t nak min t nak max t timeout authentication part 1 661 st timeout 661 st timeout 1 ms authentication part 2 113 st timeout 113 st timeout 1 ms fig 14. mifare read 001aam21 1 crc crc addr pcd cmd data picc ,,ack'' 368 s 1548 s picc nak ,,nak'' time out t timeout t nak t ack 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 21 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 11.3 mifare write the mifare write requires a block address, and writes 16 bytes of data into the addressed mifare classic 1k block. it needs two pairs of command-response. these two parts, mifare write part 1 and part 2 are shown in figure 15 , figure 16 and ta b l e 1 6 . ta b l e 1 7 shows the required timing. table 14. mifare read command name code description length cmd 30h read one block 1 byte addr - mifare block address (00h to ffh) 1 byte crc - crc according to ref. 4 2 bytes data - data content of the addressed block 16 bytes nak see table 9 see section 10.3 4-bit table 15. mifare read timing these times exclude the end of communication of the pcd. t ack min t ack max t nak min t nak max t timeout read 71 st timeout 71 st timeout 5 ms fig 15. mifare write part 1 001aam21 2 crc addr pcd cmd picc ,,ack'' 368 s picc nak ,,nak'' time out t timeout t nak t ack 59 s ack 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 22 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic remark: the minimum required time between mifa re write part 1 and part 2 is the minimum required fdt acc. to ref. 4 . there is no maximum specified. 11.4 mifare increment, decrement and restore the mifare increment requires a source block address and an operand. it adds the operand to the value of the ad dressed block, and stores the result in a volatile memory. the mifare decrement requires a source block address and an operand. it subtracts the operand from the value of the addressed block, and stores the result in a volatile memory. the mifare restore requires a source block address. it copies the value of the addressed block into a volatile memory. these two parts of each command are shown in figure 17 , figure 18 and ta b l e 1 8 . ta b l e 1 9 shows the required timing. fig 16. mifare write part 2 table 16. mifare write command name code description length cmd a0h read one block 1 byte addr - mifare block or page address (00h to ffh) 1 byte crc - crc according to ref. 4 2 bytes data - data 16 bytes nak see table 9 see section 10.3 4-bit table 17. mifare write timing these times exclude the end of communication of the pcd. t ack min t ack max t nak min t nak max t timeout write part 1 71 st timeout 71 st timeout 5 ms write part 2 71 st timeout 71 st timeout 10 ms 001aam21 3 crc pcd data picc ,,ack'' 1558 s picc nak ,,nak'' time out t timeout t nak t ack 59 s ack 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 23 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic fig 17. mifare increment, decrement and restore part 1 (1) increment, decrement and restore part 2 does not acknowledge fig 18. mifare increment, decrement and restore part 2 table 18. mifare increment, decrement and restore command name code description length cmd c1h increment 1 byte cmd c0h decrement 1 byte cmd c2h restore 1 byte addr - mifare source block address (00h to ffh) 1 byte crc - crc according to ref. 4 2 bytes data - operand (4 byte signed integer) 4 bytes nak see table 9 see section 10.3 4-bit 001aam21 4 crc addr pcd cmd picc ,,ack'' 368 s picc nak ,,nak'' time out t timeout t nak t ack 59 s ack 59 s 001aam21 5 crc pcd data picc ,,ack'' 538 s picc nak ,,nak'' time out t timeout t nak 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 24 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic remark: the minimum required time between mifare increment, decrement, and restore part 1 and part 2 is the minimum required fdt acc. too ref. 4 . there is no maximum specified. remark: the mifare increment, decrement, and restore commands require a mifare transfer to store the value into a destination block. remark: the mifare increment, decrement, and restore command part 2 does not provide an acknowledgement, so the regular time out has to be used instead. 11.5 mifare transfer the mifare transfer requires a destination bl ock address, and writes the value stored in the volatile memory into one mifare classic block. the command structure is shown in figure 19 and table 20 . ta b l e 2 1 shows the required timing. table 19. mifare increment, decrement and restore timing these times exclude the end of communication of the pcd. t ack min t ack max t nak min t nak max t timeout increment, decrement, and restore part 1 71 st timeout 71 st timeout 5 ms increment, decrement, and restore part 2 71 st timeout 71 st timeout 5 ms fig 19. mifare transfer 001aam21 6 crc addr pcd cmd picc ,,ack'' 368 s picc nak ,,nak'' time out t timeout t nak t ack 59 s ack 59 s
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 25 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 12. limiting values [1] stresses above one or more of the limiting values may cause permanent damage to the device [2] exposure to limiting values for ext ended periods may affect device reliability [3] mil standard 883-c method 3015; human body model: c = 100 pf, r = 1.5 k 13. characteristics [1] stresses above one or more of the values may cause permanent damage to the device. [2] exposure to limiting values for ext ended periods may affect device reliability. [3] lcr meter, t amb = 22 c, f i = 13.56 mhz, 2.8 v rms. table 20. mifare transfer command name code description length cmd b0h write value into destination block 1 byte addr - mifare destination block address (00h to ffh) 1 byte crc - crc according to ref. 4 2 bytes nak see table 9 see section 10.3 4-bit table 21. mifare transfer timing these times exclude the end of communication of the pcd. t ack min t ack max t nak min t nak max t timeout transfer 71 st timeout 71 st timeout 10 ms table 22. limiting values [1] [2] in accordance with the absolute maximum rating system (iec 60134). symbol parameter min max unit i i input current - 30 ma p tot /pack total power dissipation per package - 200 mw t stg storage temperature ? 55 +125 c t amb ambient temperature ? 25 +70 c v esd electrostatic discharge voltage [3] 2- kv i lu latch-up current 100 - ma table 23. characteristics [1] [2] symbol parameter conditions min typ max unit c i input capacitance [3] 15.0 17.0 19.0 pf f i input frequency - 13.56 - mhz eeprom characteristics t ret retention time t amb = 22 c 10 - - year n endu(w) write endurance t amb = 22 c 100000 200000 - cycle
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 26 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 14. package outline fig 20. package outline sot500-2 unit d references outline version european projection issue date iec jedec jeita mm 35.05 34.95 for unspecified dimensions see pllmc-drawing given in the subpackage code. dimensions (mm are the original dimensions) sot500-2 03-09-17 06-05-22 - - - - - - - - - p llmc: plastic leadless module carrier package; 35 mm wide tape sot500- 2 a (1) max. 0.33 0 10 20 mm scale a detail x x note 1. total package thickness, exclusive punching burr. d
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 27 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 15. abbreviations 16. references [1] mifare (card) coil design guide ? application note, bu-id document number 0117** 1 [2] mifare type identification procedure ? application note, bu-id document number 0184** [3] iso/iec 14443-2 ? 2001 [4] iso/iec 14443-3 ? 2001 [5] mifare & i-code cl rc6 32 multiple protocol c ontactless reader ic ? product data sheet [6] mifare and handling of uids ? application note, bu-id document number 1907** table 24. abbreviations and symbols acronym description atqa answer to request, type a crc cyclic redundancy check eeprom electrically erasable programmable read-only memory ffc film frame carrier ic integrated circuit lcr l = inductance, capacitance, resistance (lcr meter) lsb least significant bit nak not acknowledge nuid non-unique identifier nv non-volatile memory pcd proximity coupling device (contactless reader) picc proximity integrated circuit card (contactless card) reqa request command, type a rf radio frequency rms root mean square sak select acknowledge, type a secs-ii semi equipment communications standard part 2 tiw titanium tungsten uid unique identifier wupa wake-up protocol type a 1. ** ... document version number
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 28 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 17. revision history table 25. revision history document id release date data sheet status change notice supersedes MF1S5009 v.3.1 20100727 product data sheet - MF1S5009 v.3.0 modifications: ? all drawings updated MF1S5009 v.3.0 20100610 product data sheet - -
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 29 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 30 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. mifare ? is a trademark of nxp b.v. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
MF1S5009 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet public rev. 3 ? 27 july 2010 189131 31 of 32 nxp semiconductors MF1S5009 mainstream contactless smart card ic 20. tables table 1. ordering information . . . . . . . . . . . . . . . . . . . . .3 table 2. bonding pad assignments to smart card contactless module . . . . . . . . . . . . . . . . . . . . . . .4 table 3. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .4 table 4. memory operations . . . . . . . . . . . . . . . . . . . . . .12 table 5. access conditions . . . . . . . . . . . . . . . . . . . . . . .13 table 6. access conditions for the sector trailer . . . . . .14 table 7. access conditions for data blocks. . . . . . . . . . .15 table 8. command overview . . . . . . . . . . . . . . . . . . . . .16 table 9. mifare ack and nak . . . . . . . . . . . . . . . . . .17 table 10. atqa response of the MF1S5009 . . . . . . . . . .18 table 11. sak response of the MF1S5009 . . . . . . . . . . .18 table 12. mifare authentication command . . . . . . . . . .20 table 13. mifare authentication timing . . . . . . . . . . . . .20 table 14. mifare read command . . . . . . . . . . . . . . . . . 21 table 15. mifare read timing . . . . . . . . . . . . . . . . . . . . 21 table 16. mifare write command . . . . . . . . . . . . . . . . . 22 table 17. mifare write timing . . . . . . . . . . . . . . . . . . . . 22 table 18. mifare increment, decrement and restore command . . . . . . . . . . . . . . . . . . . . . . 23 table 19. mifare increment, decrement and restore timing . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 20. mifare transfer command. . . . . . . . . . . . . . . 25 table 21. mifare transfer timing. . . . . . . . . . . . . . . . . . 25 table 22. limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . 25 table 23. characteristics [1][2] . . . . . . . . . . . . . . . . . . . . . 25 table 24. abbreviations and symbols . . . . . . . . . . . . . . . 27 table 25. revision history . . . . . . . . . . . . . . . . . . . . . . . . 28 21. figures fig 1. mifare card reader . . . . . . . . . . . . . . . . . . . . . . .1 fig 2. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 fig 3. contact assignments for sot500-2 (moa4) . . . .4 fig 4. chip orientation and bond pad locations . . . . . . . .6 fig 5. three pass authentication . . . . . . . . . . . . . . . . . . .8 fig 6. memory organization . . . . . . . . . . . . . . . . . . . . . .10 fig 7. manufacturer block . . . . . . . . . . . . . . . . . . . . . . . 11 fig 8. value blocks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 fig 9. sector trailer . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 fig 10. access conditions . . . . . . . . . . . . . . . . . . . . . . . .13 fig 11. frame delay time (from pcd to picc), and t ack and t nak . . . . . . . . . . . . . . . . . . . . . . . .17 fig 12. mifare authentication part 1 . . . . . . . . . . . . . . .19 fig 13. mifare authentication part 2 . . . . . . . . . . . . . . .19 fig 14. mifare read . . . . . . . . . . . . . . . . . . . . . . . . . . .20 fig 15. mifare write part 1 . . . . . . . . . . . . . . . . . . . . . .21 fig 16. mifare write part 2 . . . . . . . . . . . . . . . . . . . . . .22 fig 17. mifare incremen t, decrement and restore part 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 fig 18. mifare incremen t, decrement and restore part 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 fig 19. mifare transfer . . . . . . . . . . . . . . . . . . . . . . . . .24 fig 20. package outline sot500-2 . . . . . . . . . . . . . . . . .26
nxp semiconductors MF1S5009 mainstream contactless smart card ic ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 27 july 2010 189131 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 22. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 1.1 key applications . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 simple integration and user convenience. . . . . 1 1.4 security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.5 delivery options . . . . . . . . . . . . . . . . . . . . . . . . 2 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 2.1 mifare? rf interface (iso/iec 14443 a) . . . . 2 2.2 eeprom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 smart card contactless module . . . . . . . . . . . . 4 7 mechanical specification . . . . . . . . . . . . . . . . . 4 7.1 fail die identification . . . . . . . . . . . . . . . . . . . . . 5 8 chip orientation and bond pad locations . . . . 6 9 functional description . . . . . . . . . . . . . . . . . . . 7 9.1 block description . . . . . . . . . . . . . . . . . . . . . . . 7 9.2 communication principle . . . . . . . . . . . . . . . . . 7 9.2.1 request standard / all. . . . . . . . . . . . . . . . . . . . 7 9.2.2 anticollision loop . . . . . . . . . . . . . . . . . . . . . . . . 7 9.2.3 select card . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.2.4 three pass authentication . . . . . . . . . . . . . . . . 8 9.2.5 memory operations . . . . . . . . . . . . . . . . . . . . . . 9 9.3 data integrity. . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9.4 three pass authentication sequence . . . . . . . . 9 9.5 rf interface . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9.6 memory organization . . . . . . . . . . . . . . . . . . . 10 9.6.1 manufacturer block . . . . . . . . . . . . . . . . . . . . . 11 9.6.2 data blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.6.2.1 value blocks . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.6.3 sector trailer (block 3) . . . . . . . . . . . . . . . . . . 12 9.7 memory access . . . . . . . . . . . . . . . . . . . . . . . 12 9.7.1 access conditions . . . . . . . . . . . . . . . . . . . . . . 13 9.7.2 access conditions for the sector trailer . . . . . . 14 9.7.3 access conditions for data blocks. . . . . . . . . . 14 10 command overview . . . . . . . . . . . . . . . . . . . . . 16 10.1 mifare command overview . . . . . . . . . . . . . 16 10.2 timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10.3 mifare ack and nak . . . . . . . . . . . . . . . . . 17 10.4 atqa and sak responses . . . . . . . . . . . . . . . 18 11 mifare classic commands . . . . . . . . . . . . . . 19 11.1 mifare authentication . . . . . . . . . . . . . . . . . 19 11.2 mifare read. . . . . . . . . . . . . . . . . . . . . . . . . 20 11.3 mifare write . . . . . . . . . . . . . . . . . . . . . . . . . 21 11.4 mifare increment, decrement and restore . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 11.5 mifare transfer . . . . . . . . . . . . . . . . . . . . . . 24 12 limiting values . . . . . . . . . . . . . . . . . . . . . . . . 25 13 characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25 14 package outline. . . . . . . . . . . . . . . . . . . . . . . . 26 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 27 16 references. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 17 revision history . . . . . . . . . . . . . . . . . . . . . . . 28 18 legal information . . . . . . . . . . . . . . . . . . . . . . 29 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 29 18.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 30 19 contact information . . . . . . . . . . . . . . . . . . . . 30 20 tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 21 figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 22 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

▲Up To Search▲

Price & Availability of MF1S5009

	To Download MF1S5009 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .